Investigation of the curing process of an epoxy system through changes in viscosity and consistency for evaluating polymer network structure formation
DOI:
https://doi.org/10.62239/jca.2026.053Keywords:
Bisphenol F, curing kinetics, viscosity evolution, polymer network formation, well plugging, TETAAbstract
This study investigates the curing process of a Bisphenol F-based epoxy system through changes in viscosity and consistency to evaluate polymer network development. Three formulations, XD1, XD2, and XD3, containing 14.66, 15.43, and 16.20 phr TETA, respectively, were prepared and characterized by FT-IR, DSC, TGA, Fann Viscometer, and HTHP Consistometer. The results showed that viscosity decreased with increasing shear rate, with values of 8.5-12.0 cP at 88 °C. TETA content significantly affected curing behavior: XD1 reached 70 Bc after 4 h 56 min but did not reach 100 Bc, while XD2 and XD3 reached 100 Bc after 5 h 48 min and 4 h 30 min, respectively. The increase in consistency was attributed to the ring-opening reaction between epoxy and amine groups, leading to the formation of a crosslinked polymer network. These results demonstrate that viscosity and consistency changes can be used to evaluate epoxy curing behavior and support its application in well plugging.
Downloads
References
C. Garschke, P.P. Parlevliet, C. Weimer, B.L. Fox, Polym. Test., 32(1) (2013) 150–157. https://doi.org/10.1016/j.polymertesting.2012.09.011
A. Shundo, S. Yamamoto, K. Tanaka, JACS Au, 2(7) (2022) 1522–1542. https://doi.org/10.1021/jacsau.2c00120
M.H. Karami, M.R. Kalaee, S. Mazinani, M. Shakiba, S. Shafiei Navid, M. Abdouss, A. Beig Mohammadi, W. Zhao, M. Koosha, Z. Song, T. Li, Molecules, 27(9) (2022) 2870. https://doi.org/10.3390/molecules27092870
M. Müller-Pabel, J.A. Rodríguez Agudo, M. Gude, Polym. Test., 114 (2022) 107701. https://doi.org/10.1016/j.polymertesting.2022.107701
Z. Zhou, R. Bai, M. Ren, J. Sun, Z. Zhou, Q. Hu, C. Wang, Polym. Polym. Compos., 19(4–5) (2011) 345–350. https://doi.org/10.1177/0967391111019004-514
X. Yang, H. Chen, Y. Wang, W. Zheng, J. Sun, Y. Liu, J. Zhou, Molecules, 31(4) (2026) 640. https://doi.org/10.3390/molecules31040640
J. Wei, J. Yan, S. Li, J. Li, Z. Wu, Polymers, 16(19) (2024) 2759. https://doi.org/10.3390/polym16192759
ASTM International, ASTM D1652-24: Standard Test Methods for Epoxy Content of Epoxy Resins, ASTM International, West Conshohocken, PA (2024).
Q. Yuan, Z. Wang, H. Yao, J. Huang, S. Zuo, H. Huang, Int. J. Adhes. Adhes., 126 (2023) 103473. https://doi.org/10.1016/j.ijadhadh.2023.103473
S.M.A. Soliman, M. Abdelhakim, M.W. Sabaa, BMC Chem., 18(1) (2024) 211. https://doi.org/10.1186/s13065-024-01319-8
D. Matykiewicz, B. Dudziec, ACS Omega, 10(5) (2025) 4353–4366. https://doi.org/10.1021/acsomega.4c06532
Downloads
Published
Issue
Section
License
Copyright (c) 2026 Tang Duc Nhien, Bui Duc Chinh, Le Van Chung, Hoàng Trần, Dao Quoc Tuy
This work is licensed under a Creative Commons Attribution 4.0 International License.
How to Cite
