Research on the synthesis of low-viscosity epoxy materials capable of curing in water for application in oil and gas well sealing
DOI:
https://doi.org/10.62239/jca.2025.028Keywords:
Epoxy materials, Oil recovery, Low viscosity, Accelerator, Curing timeAbstract
Research on the synthesis of low-viscosity epoxy materials capable of curing in water for use in the grouting of oil and gas structures. The base epoxy is synthesized from the reaction of the epoxy groups in epichlorohydrin and the hydroxyl groups in bisphenol-A, using a 20% sodium hydroxide solution as a catalyst for the synthesis process. The resin system uses diethyl toluene diamine as a curing agent, 1,6-Hexanediol diglycidyl ether as a diluent to reduce viscosity, and 2,4,6-Tris(dimethylaminomethyl)phenol as an accelerator to adjust the curing reaction time. The structure of the epoxy resin is characterized by Fourier-transform infrared spectroscopy (FTIR). Thermal stability is evaluated using Thermogravimetric analysis (TGA) and Differential scanning calorimetry (DSC). The equivalent weight of the epoxy is determined by the ASTM D1652 chemical titration method. The viscosity and gel time under high temperature and high-pressure conditions are determined using a specialized Consistormeter according to API standards. The compressive strength UCA of the epoxy is assessed after 24 hours of curing. Rheological parameters are determined using a rheometer and FANN viscosity meter. Experimental results show that the resin has low viscosity, can cure in water, and the material after curing exhibits high mechanical strength and thermal stability. It has an appropriate curing time and viscosity under conditions of 85°C and 35.6 MPa.
Downloads
References
S.E.A. Mahmoud, ACS Omega, 9(8) (2024) 8654. https://doi.org/10.1021/acsomega.3c07365
M. Mazloom, A.A. Ramezanianpour, J.J. Brooks, Cem. Concr. Compos., 26(4) (2004) 347–357. https://doi.org/10.1016/S0958-9465(03)00017-9
X. Tang, W. Luo, Y. Yang, X. Hu, X. Li, Case Stud. Constr. Mater., 22 (2025) e04390. https://doi.org/10.1016/j.cscm.2025.e04390
H.M. Hamada, F. Abed, H.Y.B. Katman, A.M. Humada, M.S. Al Jawahery, A. Majdi, S.T. Yousif, B.S. Thomas, J. Mater. Res. Technol., 24 (2023) 8887–8908. https://doi.org/10.1016/j.jmrt.2023.05.147
J. Han, J. Wang, W. Yang, X. Wang, R. Ma, W. Wang, S. Zhu, T. Li, Case Stud. Constr. Mater., 19(–) (2023) e02552. https://doi.org/10.1016/j.cscm.2023.e02552
J. Cao, C. Huang, H. Sun, Y. Guo, W. Ding, G. Hua, Appl. Sci., 13(23) (2023) 12700. https://doi.org/10.3390/app132312700
N. Dou, Z. Wang, G. Leng, H. Liu, Appl. Sci., 13(16) (2023) 2771. https://doi.org/10.3390/app13162771
Y. Chen, Y. Li, Y. Peng, D. Zhang, J. Ye, Y. Jiang, ACS Omega, 9(18) (2024) 19732–19736. https://doi.org/10.1021/acsomega.3c10034
J. Song, M. Xu, C. Tan, F. You, X. Wang, S. Zhou, Mater., 15(15) (2022) 5258. https://doi.org/10.3390/ma15155258
F.L. Jin, X. Li, S.J. Park, J. Ind. Eng. Chem., 29(–) (2015) 1–11. https://doi.org/10.1016/j.jiec.2015.03.026
Z. Zeng, T. Zhao, Y. Gong, Z. Yu, Eur. Polym. J., 219(–) (2024) 113375. https://doi.org/10.1016/j.eurpolymj.2024.113375
J. Xie, K. Huang, Q. Yao, C. Ding, Adv. Mater. Res., 580 (2012) 564–568. https://doi.org/10.4028/www.scientific.net/AMR.580.564
H. Li, X. Pang, S. Ghabezloo, J. Zhang, X. Shi, J. Qin, J. Mater. Res. Technol., 26 (2023) 3992–4006. https://doi.org/10.1016/j.jmrt.2023.08.211
A. Rudawska, M. Frigione, Polymers, 14(11) (2022) 2277. https://doi.org/10.3390/polym14112277
X. Zhao, W. Li, X. Yang, W. Li, F. Zou, W. Guo, G. Zhang, High Volt. Eng., 10 (2024) 12481. https://doi.org/10.1049/hve2.12481
Downloads
Published
Issue
Section
License
Copyright (c) 2025 Hoang Thi Yen, Pham Duc Duong, Le Hoang Yen Trang, Vu Thi Hue, Tran Xuan Hiep, Dao Quoc Tuy
This work is licensed under a Creative Commons Attribution 4.0 International License.
How to Cite
